Morphological stability and surface growth mechanism studies in electrocrystallization of copper

dc.contributor.advisorLipkowski, Jacek
dc.contributor.authorZhao, Tinghe
dc.date.accessioned2021-03-31T15:37:31Z
dc.date.available2021-03-31T15:37:31Z
dc.date.copyright1999
dc.degree.departmentDepartment of Chemistry and Biochemistryen_US
dc.degree.grantorUniversity of Guelphen_US
dc.degree.nameMaster of Scienceen_US
dc.description.abstractThis thesis describes the investigation of the surface morphology evolution as a function of time and variables such as temperature, concentration of organic additives and current density. To extract the morphological information, digital analysis of AFM images was performed. It involved scaling analysis and spectral power density. The morphological information contained in the image can be encoded in a small set of parameters--scaling exponents. The spectral power density gives insight into smoothing and roughening mechanisms dominating the surface growth. Nodulation was also studied in this thesis. The affect of anode passivation on the nodulation of the deposited Cu was identified in the laboratory. A high concentration of glue initiates nodulation during Cu electrodeposition. Three models are discussed to elucidate the nodulation mechanisms. We have demonstrated that different mechanisms leave a characteristic signature in the nodule morphology. These characteristics of nodules may be used to identify the cause of nodulation.en_US
dc.identifier.urihttps://hdl.handle.net/10214/24294
dc.language.isoen
dc.publisherUniversity of Guelphen_US
dc.rights.licenseAll items in the Atrium are protected by copyright with all rights reserved unless otherwise indicated.
dc.subjectsurface morphology evolutionen_US
dc.subjecttimeen_US
dc.subjecttemperatureen_US
dc.subjectorganic additivesen_US
dc.subjectcurrent densityen_US
dc.subjectmorphological informationen_US
dc.subjectdigital analysisen_US
dc.subjectAFM imagesen_US
dc.subjectscaling exponentsen_US
dc.subjectspectral power densityen_US
dc.subjectnodulationen_US
dc.subjectmorphological stabilityen_US
dc.subjectsurface growth mechanismen_US
dc.subjectelectrocrystallizationen_US
dc.subjectcopperen_US
dc.titleMorphological stability and surface growth mechanism studies in electrocrystallization of copperen_US
dc.typeThesisen_US

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